Prime Minister Narendra Modi formally inaugurated the fifth edition of SEMICON India 2026 at Yashobhoomi in New Delhi on Thursday, September 17, marking a pivotal milestone in the country's national technology strategy. Operating under the theme "Silicon to Systems: Building the Ecosystem," the high-profile three-day international convention brings together over 600 global chipmakers, technology executives, researchers, and government leaders from more than 20 countries. The summit follows the official approval of the expanded ₹1.27 lakh-crore "Semicon 2.0" policy package, which dramatically shifts state support toward domestic chip design, building IP, and localizing raw material supply chains alongside physical wafer fabrication. Key multinational chip majors—including Micron, Applied Materials, Tokyo Electron, ASML, Infineon, and Intel—participated in strategic executive roundtables aimed at integrating Indian design and assembly nodes directly into global semiconductor supply networks. Government officials highlighted that the revised national framework offers up to 40% capital expenditure support for silicon wafer fabs, alongside dedicated Electronic Design Automation (EDA) tool access for over 400 academic institutions and 105 domestic deep-tech startups. Technology analysts observe that expanding fiscal incentives across both manufacturing and fabless chip design positions India as a trusted, resilient hub in the international microelectronics supply chain. \Semicon 2.0 Unveiled to Scale Domestic Chip Value Chain Prime Minister Narendra Modi officially opened SEMICON India 2026 at the Yashobhoomi Convention Centre in Dwarka, New Delhi. Marking the inauguration of the three-day flagship conference themed "Silicon to Systems: Building the Ecosystem," the Prime Minister announced the formal execution of the government’s upgraded Semicon 2.0 initiative. Backed by an expanded total budget allocation of ₹1,27,500 crore (approx. $15.2 billion)—building on the original ₹76,000 crore framework launched under Semicon 1.0—the policy shift expands federal incentives from standalone chip manufacturing to creating a self-sustaining, full-stack domestic electronics ecosystem. Six Strategic Pillars and Upstream Equipment IncentivesIn his key address, Prime Minister Modi emphasized that building a semiconductor industry requires simultaneous progress across all ecosystem layers rather than isolated assembly lines. Semicon 2.0 expands federal focus across six structural pillars: commercial fabs, advanced OSAT/ATMP packaging, deep-tech chip design, advanced R&D, specialized workforce creation, and domestic manufacturing of precision machines and raw materials (gases, chemicals, and substrates). To insulate supply chains from global disruption, Union IT Minister Ashwini Vaishnaw highlighted that a high-level committee co-chaired by the Principal Scientific Adviser (PSA) and National Security Adviser (NSA) will directly identify strategically critical semiconductor products for prioritized fiscal grants. Global Supply Chain Resilience and Talent Pool CommitmentsAddressing global executives and industry association SEMI, the Prime Minister noted that establishing a trusted semiconductor hub in India serves as a vital anchor for international supply chain stability. "When a country like India succeeds in a critical industry, it strengthens the supply chain of the entire world at a time when supply chains are being weaponized," Modi stated. Corroborating the industrial roadmap, the IT Ministry confirmed plans to train 100,000 specialized engineers to immediately staff incoming fabrication plants and testing facilities across the country. With commercial production already underway at several early-stage ATMP units, India's broader chip strategy aims to meet 100% of domestic demand for critical components like power sensors and automotive SoCs over the coming decade.